Nichia STSE-CC5147A
<Cat.No.051025>
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item
Resistance to
Soldering Heat
(Reflow Soldering)
Solderability
(Reflow Soldering)
Thermal Shock
Temperature Cycle
High Temperature Storage
Temperature Humidity
Storage
Low Temperature Storage
Steady State Operating Life
Steady State Operating Life
of High Temperature
Steady State Operating Life
of High Humidity Heat
Steady State Operating Life
of Low Temperature
Vibration
Standard
Test Method
JEITA ED-4701
300 301
JEITA ED-4701
300 303
JEITA ED-4701
300 307
JEITA ED-4701
100 105
JEITA ED-4701
200 201
JEITA ED-4701
100 103
JEITA ED-4701
200 202
Test Conditions
Tsld=260°C, 10sec.
(Pre treatment 30°C,70%,168hrs.)
Tsld=215 ± 5°C, 3sec.
(Lead Solder)
0°C ~ 100°C
15sec. 15sec.
-40°C ~ 25°C ~ 100°C ~ 25°C
30min. 5min. 30min. 5min.
Ta=100°C
Ta=60°C, RH=90%
Ta=-40°C
Ta=25°C, I
F
=150mA
Tested with Nichia standard circuit board.
Note
2 times
Number of
Damaged
0/50
1 time
over 95%
20 cycles
100 cycles
500 hrs.
500 hrs.
500 hrs.
500 hrs.
500 hrs.
500 hrs.
500 hrs.
48min.
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
0/50
Ta=70°C, I
F
=100mA
Tested with Nichia standard circuit board.
60°C, RH=90%, I
F
=100mA
Tested with Nichia standard circuit board.
Ta=-40°C, I
F
=150mA
Tested with Nichia standard circuit board.
JEITA ED-4701
400 403
JEITA ED-4702
JEITA ED-4702
JEITA ED-4701
300 304
Substrate Bending
Adhesion Strength
Electrostatic Discharges
100 ~ 2000 ~ 100Hz Sweep 4min.
200m/s
2
3direction, 4cycles
3mm, 5 ± 1 sec.
5N,
10 ± 1 sec.
1 time
1 time
3 times
Negative/Positive
0/50
0/50
0/50
R=1.5kΩ, C=100pF
Test Voltage=2kV
Thermal resistance of LED with Nichia standard circuit board : Rja
≒
120°C/W
Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm
(2) CRITERIA FOR JUDGING DAMAGE
Item
Symbol Test Conditions
Forward Voltage
V
F
I
F
=150mA
-
Initial Level
Luminous Flux
φv
I
F
=150mA
Initial Level 0.7
-
The test is performed after the board is cooled down to the room temperature.
-3-
Criteria for Judgement
Min.
Max.
1.1