NICHIA STS-DA1-4544 <Cat.No.161031>
* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.
Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability.
When using automatic pick and place machine, use a pick up nozzle which does not directly apply stress
to the encapsulation of the LEDs.
Recommended conditions:
It is recommended to use a pick up nozzle designed for the LEDs. (See Figure below.)
* If the LEDs are picked and placed by a nozzle that does not comply with the recommended conditions,
it may cause the wires to break and the LED not to illuminate.
Φ1
R1
4.8
5.6
4.8
5.6
C0.23
(単�½� Unit: mm)
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
a hot plate should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
* The Cathode 2 should be soldered to customer PCB.
If it is difficult or impossible, use high heat-dissipating adhesive.
* When soldering, do not apply stress to the LED while the LED is hot.
* When using a pick and place machine, choose an appropriate nozzle for this product. Using a pick-and-place nozzle
with a smaller diameter than the size of the LED's emitting surface will cause damage to the emitting surface
and may also cause the LED not to illuminate.
* The recommended soldering pad pattern is designed for attachment of the LED without problems.
When precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad
are suitable for the circuit design.
* When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner
where the flux will come in contact with the LEDs.
* Make sure that there are no issues with the type and amount of solder that is being used.
0.5
8
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