Nichia STSE-CC4082A
<Cat.No.041125>
(4) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method.
Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Pre-heat
Pre-heat time
Peak temperature
Soldering time
Condition
Recommended soldering paste
Melting temperature
composition
Reflow Soldering
Lead Solder
140
~
160°C
60 sec. Max.
240°C Max.
10 sec. Max.
refer to
Temperature - profile
1
.
178 ~ 192°C
Sn 63%, Pb 37%
Hand Soldering
Lead-free Solder
160
~
180°C
140 sec. Max.
260°C Max.
1 sec. Max.
refer to
Temperature - profile
2
.
216
~
220°C
Sn 3.5Ag 0.75Cu
Soldering Iron
Temperature
Soldering time
Soldering paste
composition
25W Max.
300°C Max.
3 sec. Max.
(one time only)
Sn6/Pb4 or
solder containing
silver (Ag)
After reflow soldering rapid cooling should be avoided.
[Temperature-profile
(the top surface of the parts)]
Use the conditions shown to the under figure.
<
1
: Lead Solder>
<
2
: Lead-free Solder>
4°C / sec. Max.
Pre-heating
140 ~ 160°C
60sec.Max.
Above 200
°C
60sec. Min.
240°C Max.
10sec. Max.
4°C / sec. Max.
4°C / sec. Max.
Pre-heating
160 ~ 180°C
260°C Max.
1sec. Max.
4°C / sec. Max.
60
~70
sec.
Above 220
°C
140sec.Max.
[Recommended soldering pad design]
The following dimensions do not guarantee
the performance of mountability.
Use the following pattern after deep study.
0.8
0.7
0.8
· Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable,
a double-head soldering iron should be used.
It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· Before soldering every time, make baking to units. By manual soldering, there is possibility of crack
due to the moisture absorption in the resin portion.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
· Handle the devices only after temperature is cooled down.
(5) Washing
· When washing after soldering is needed, following conditions are requested.
a) Washing solvent: Ak – 225 Alcohol
b) Temperature and time: 50°C or less
×
30 seconds Max, or 30°C or less
×
3 minutes Max.
c) Ultrasonic washing: Basically Not accepted.
-5-
0 .8
(Unit : mm)
NICHIA [ NICHIA CORPORATION ]
