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NESWC04T 参数 Datasheet PDF下载

NESWC04T图片预览
型号: NESWC04T
PDF下载: 下载PDF文件 查看货源
内容描述: 式白光LED [TYPE WHITE LED]
分类和应用:
文件页数/大小: 12 页 / 549 K
品牌: NICHIA [ NICHIA CORPORATION ]
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Nichia STSE-CC4082A  
<Cat.No.041125>  
(4) Soldering Conditions  
· The LEDs can be soldered in place using the reflow soldering method.  
Nichia cannot make a  
guarantee on the LEDs after they have been assembled using the dip soldering method.  
· Recommended soldering conditions  
Reflow Soldering  
Lead Solder  
Hand Soldering  
Lead-free Solder  
Pre-heat  
Soldering Iron  
Temperature  
25W Max.  
140 ~ 160°C  
160 ~ 180°C  
Pre-heat time  
Peak temperature  
Soldering time  
Condition  
60 sec. Max.  
140 sec. Max.  
260°C Max.  
300°C Max.  
240°C Max.  
Soldering time 3 sec. Max.  
(one time only)  
10 sec. Max.  
1 sec. Max.  
refer to  
refer to  
Temperature - profile 1.  
Temperature - profile 2.  
Recommended soldering paste  
Melting temperature  
composition  
Soldering paste  
composition  
Sn6/Pb4 or  
178 ~ 192°C  
216 ~ 220°C  
solder containing  
silver (Ag)  
Sn 63%, Pb 37%  
Sn 3.5Ag 0.75Cu  
After reflow soldering rapid cooling should be avoided.  
[Temperature-profile (the top surface of the parts)]  
Use the conditions shown to the under figure.  
<1: Lead Solder>  
<2: Lead-free Solder>  
4°C / sec. Max.  
4°C / sec. Max.  
260°C Max.  
1sec. Max.  
240°C Max.  
10sec. Max.  
Pre-heating  
Pre-heating  
4°C / sec. Max.  
160 ~ 180°C  
4°C / sec. Max.  
140 ~ 160°C  
60sec.Max.  
Above 200°C  
60~70sec.  
Above 220°C  
140sec.Max.  
60sec. Min.  
[Recommended soldering pad design]  
The following dimensions do not guarantee  
the performance of mountability.  
Use the following pattern after deep study.  
0.8  
0.7  
0.8  
(Unit : mm)  
· Repairing should not be done after the LEDs have been soldered.  
When repairing is unavoidable,  
a double-head soldering iron should be used. It should be confirmed beforehand whether the  
characteristics of the LEDs will or will not be damaged by repairing.  
· Reflow soldering should not be done more than two times.  
· Before soldering every time, make baking to units. By manual soldering, there is possibility of crack  
due to the moisture absorption in the resin portion.  
· When soldering, do not put stress on the LEDs during heating.  
· After soldering, do not warp the circuit board.  
· Handle the devices only after temperature is cooled down.  
(5) Washing  
· When washing after soldering is needed, following conditions are requested.  
a) Washing solvent: Ak – 225 Alcohol  
b) Temperature and time: 50°C or less × 30 seconds Max, or 30°C or less × 3 minutes Max.  
c) Ultrasonic washing: Basically Not accepted.  
-5-  
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