Nichia STSE-CC4082A
<Cat.No.041125>
(4) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method.
Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Reflow Soldering
Lead Solder
Hand Soldering
Lead-free Solder
Pre-heat
Soldering Iron
Temperature
25W Max.
140 ~ 160°C
160 ~ 180°C
Pre-heat time
Peak temperature
Soldering time
Condition
60 sec. Max.
140 sec. Max.
260°C Max.
300°C Max.
240°C Max.
Soldering time 3 sec. Max.
(one time only)
10 sec. Max.
1 sec. Max.
refer to
refer to
Temperature - profile 1.
Temperature - profile 2.
Recommended soldering paste
Melting temperature
composition
Soldering paste
composition
Sn6/Pb4 or
178 ~ 192°C
216 ~ 220°C
solder containing
silver (Ag)
Sn 63%, Pb 37%
Sn 3.5Ag 0.75Cu
ꢅAfter reflow soldering rapid cooling should be avoided.
[Temperature-profile (the top surface of the parts)]
Use the conditions shown to the under figure.
<1: Lead Solder>
<2: Lead-free Solder>
4°C / sec. Max.
4°C / sec. Max.
260°C Max.
1sec. Max.
240°C Max.
10sec. Max.
Pre-heating
Pre-heating
4°C / sec. Max.
160 ~ 180°C
4°C / sec. Max.
140 ~ 160°C
60sec.Max.
Above 200°C
60~70sec.
Above 220°C
140sec.Max.
60sec. Min.
[Recommended soldering pad design]
The following dimensions do not guarantee
the performance of mountability.
Use the following pattern after deep study.
0.8
0.7
0.8
(Unit : mm)
· Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable,
a double-head soldering iron should be used. It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· Before soldering every time, make baking to units. By manual soldering, there is possibility of crack
due to the moisture absorption in the resin portion.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
· Handle the devices only after temperature is cooled down.
(5) Washing
· When washing after soldering is needed, following conditions are requested.
a) Washing solvent: Ak – 225 Alcohol
b) Temperature and time: 50°C or less × 30 seconds Max, or 30°C or less × 3 minutes Max.
c) Ultrasonic washing: Basically Not accepted.
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