Nichia STSE-CC5074B
<Cat.No.060530>
(4) Soldering Conditions
· The LEDs can be soldered in place using the reflow soldering method.
Nichia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
· Recommended soldering conditions
Pre-heat
Pre-heat time
Peak
temperature
Soldering time
Condition
Reflow Soldering
Lead Solder
Lead-free Solder
180
~
200°C
120
~
150°C
120 sec. Max.
120 sec. Max.
240°C Max.
260°C Max.
10 sec. Max.
10 sec. Max.
refer to
refer to
Temperature - profile
1
. Temperature - profile
2
.
(N
2
reflow is recommended.)
Hand Soldering
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
After reflow soldering rapid cooling should be avoided.
[Temperature-profile
(Surface of circuit board)]
Use the conditions shown to the under figure.
<
1
: Lead Solder>
2.5 ~ 5°C / sec.
Pre-heating
120 ~ 150°C
60sec.Max.
Above 200
°C
120sec.Max.
240°C Max.
10sec. Max.
1~ 5°C / sec.
<
2
: Lead-free Solder>
1~ 5°C / sec.
Pre-heating
180 ~ 200°C
60sec.Max.
Above 220
°C
120sec.Max.
260°C Max.
10sec. Max.
2.5 ~ 5°C / sec.
[Recommended soldering pad design]
Use the following conditions shown in the figure.
7
3.3
1.1
1.1
3.3
PC-Board
FR4 t = 1.6mm
3.5
1.5
Copper foil t = 35µm
(Unit : mm)
7.5
4.5
1.5
3.5
: Solder resist
· Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere
during air reflow.
It is recommended that the User use the nitrogen reflow method.
· Repairing should not be done after the LEDs have been soldered.
When repairing is unavoidable,
a double-head soldering iron should be used.
It should be confirmed beforehand whether the
characteristics of the LEDs will or will not be damaged by repairing.
· Reflow soldering should not be done more than two times.
· When soldering, do not put stress on the LEDs during heating.
· After soldering, do not warp the circuit board.
-5-
NICHIA [ NICHIA CORPORATION ]
