Surface Mount Specialty Polymer Solid Aluminum
Electrolytic Capacitors
NIC Part Number
(Reflow 240°C)
NSP4R7M12.5D2TRF
NSP100M12.5D2TRF
NSP150M12.5D5TRF
NSP150M12.5D2TRF
NSP220M12.5D2TRF
NSP2R2M16D2TRF
NSP4R7M16D2TRF
NSP6R8M16D2TRF
NSP8R2M16D2TRF
NIC Part Number
(Reflow 260°C)
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
WV
(Vdc)
Cap.
(µF)
4.7
10
15
15
22
2.2
4.7
6.8
8.2
Max. LC (µA)
240°C 260°C
3.0
-
5.0
-
7.5
-
7.5
-
11.0
-
3.0
-
3.0
-
4.4
-
5.2
-
Tan
δ
0.06
0.06
0.06
0.06
0.06
0.06
0.06
0.06
0.06
NSP Series
Height
H
1.8±0.1
1.8±0.1
1.1±0.1
1.8±0.1
1.8±0.1
1.8±0.1
1.8±0.1
1.8±0.1
1.8±0.1
12.5
16
Max. Ripple Current
Max. ESR
+105°C & 100KHz (mA) +20°C & 100KHz (Ω)
1,000
0.080
1,000
0.060
1,400
0.040
1,300
0.050
1,600
0.030
1,000
0.110
1,000
0.080
1,000
0.070
1,300
0.045
PART NUMBERING SYSTEM
NSP 101 M 12.5 D2 X TR F
RoHS Compliant
Tape and Reel
High Performance
Case Size
Working Voltage
Tolerance Code M=20%, K=10%
Capacitance Code in
µF,
first 2 digits are
significant, third digits no. of zeros
Series
TERMINATION MATERIAL:
D2 - D5 and D2X - D5X Sizes
Base: Fe (~ 100µm)
Under Plating: Cu (~ 5µm)
Finish Plating: Sn (5 ~ 9µm)
D2Z - D6Z Sizes
Base: Cu (~ 105µm)
Finish Plating: Sn (5 ~ 9µm)
RECOMMENDED
240°C
REFLOW SOLDERING PROFILE
(D2, D2Z, D3, D3X, D3Z, D4, D4X, D4Z, D5, D6Z)
5 Seconds Max.
RECOMMENDED
260°C
REFLOW SOLDERING PROFILE
(D2A, D2XA, D2ZA, D3A, D3XA, D3YA, D4A, D4XA, D4YA, D6A, D6ZA)
5 Seconds Max.
260
o
C Max.
250
230
200
COMPONENT SURFACE TEMP. (
o
C)
250
200
160
o
C PREHEAT
150
Time above
200°C
COMPONENT SURFACE TEMP. (
o
C)
240
o
C Max.
150
150
o
C ~ 200°C
PREHEAT
Time above
230°C
100
100
NATURAL COOLING
50
120 Seconds
50
120 Seconds
NATURAL COOLING
Time (Seconds)
Time (Seconds)
DURATION ABOVE 200°C (FOR 240°C REFLOW PARTS)
If Peak Soldering Temperature is
240°C
230°C
220°C
Maximum Time Above +200°C is
30 seconds
40 seconds
50 seconds
DURATION ABOVE 230°C (FOR 260°C REFLOW PARTS)
If Peak Soldering Temperature is
260°C
255°C
250°C
Maximum Time Above +230°C is
40 seconds
50 seconds
60 seconds
Notes:
1. SAC alloy (+217°C) reflow soldering compatible
2. Soldering heat limits apply to the top surface of component
3. If you have concerns about your reflow soldering profile review them with NIC
to insure compatible [tpmg@niccomp.com]
4. Two passes through the reflow process are allowed (cooling down period
between process).
®
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
67
NIC [ NIC-COMPONENTS CORP. ]
