Multilayer Chip Inductors
FEATURES
• Designed for High Frequency Applications
• Available in EIA 0402, 0603 and 0805Case Sizes
• High Q and SRF Characteristics
• Tight Tolerance D (0.3nH) and J ( 5%)
• Tape and Reel Packaging for Automatic Pick & Place
SPECIFICATIONS
NML Series
RoHS
Compliant
includes all homogeneous materials
*See Part Number System for Details
NML
Multilayer High Frequency Inductors
Specifications
0402
0603
0805
Inductance Range
1.0 ~ 120nH 1.5 ~ 220nH 1.5 ~ 470nH
Inductance Tolerance
D(±0.3nH), J (±5%), K (±10%)
Operating Temperature Range
-40°C ~ +85°C
Q-Factor, Self Resonant Frequency,
See Individual
DC Resistance, Rated DC Current
Product Listings
and Inductance Tolerance
ENVIRONMENTAL CHARACTERISTICS
Test
Solderability
Humidity Resistance
Soldering Effect
Low Frequency Vibration
Thermal Shock
Low Temperature Storage
High Temperature Load Life
Humidity Load Life
Specification
75% Min. Coverage
(1) No Evidence of Damage
(2) Inductance Shall Be Within ±10% of Initial Value
(3) Q Factor Shall Be Within ± 20% of Initial Value
(1) No Evidence of Damage
(2) Inductance Shall Be Within + 10% of Initial Value
(3) Q Factor Shall Be Within ±20% of Initial Value
Test Method & Condition
After 5 Sec. Dip in +230
o
C Solder Pot (Post Flux)
After 500 Hrs at 60
o
C and 90-95% RH (No Load)
After 10 Seconds at +260
o
C (3 Minute, 150
o
C Pre-Heat)
After 100 Cycles (+85
o
C then -40°C) 1 hour each
After 500 Hrs at 85
o
C with Rated DC Current
After 500 Hrs at 60
o
C with 90-95% RH with Rated DC Current
PART NUMBER SYSTEM
NML 04 J 22N TR F
Pb-free/RoHS compliant
Packaging: TR = Tape/Reel
Inductance Code (N=decimal point) in nano-henries
(Ex. 2N2 = 2.2nH, 33N=33nH, R10=100nH)
Tolerance Code (D=±0.3nH, J=±5%, K=±10%)
Size Code: 04=0402, 06=0603, 08=0805
Series
PART AND LAND PATTERN DIMENSIONS
Series
NML04
NML06
NML08
L
1.0 ± 0.05
1.6 ± 0.10
2.0 ± 0.2
H
t
A
B
C
0.5 ± 0.05
0.25 ± 0.1 0.50 ± 0.05 0.50 ± 0.05 0.50 ± 0.05
0.8 ± 0.15
0.30 ± 0.2 0.70 ± 0.10 0.70 ± 0.10 0.70 ± 0.10
0.85 ± 0.20
1.25 ± 0.20
0.50 ± 0.30 1.00 ± 0.10 1.00 ± 0.10 1.00 ± 0.10
1.25 ± 0.20
Solder
Pads
W
0.5 ± 0.05
0.8 ± 0.10
Body Composition:
Al
2
O
3
/B
2
O
3
/SiO
2
Termination Material/Thickness:
10µM Ni/Sn/Pb over 40µM Ag
Internal Coil: Ag
C
H
B
t
®
t
L
w
A
Component
A
www.SMTmagnetics.com
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NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
NIC [ NIC-COMPONENTS CORP. ]
