NIN Series
Molded Chip Wirewound Inductors
PACKAGING SPECIFICATIONS
t1
Perforation1.5φ±0.1
A
4.0
±0.1
P
t2
CARRIER TAPE DIMENSIONS (mm)
Case
Code
Type
Size
W ±0.3 A ±0.2
B ±0.2
P ±0.1
E ±0.1
F ±0.1
t1
t2
B
FC/NC/PC
FA/NA/PA
FB
C
A
B
8.0
8.0
2.4
2.8
3.6
2.9
3.6
4.9
4.0
4.0
8.0
1.75
1.75
1.75
3.5
3.5
5.5
0.25
0.25
0.3
1.85
2.4
C
D
12.0
3.5
2.0 ± 0.5
φ
21
0.8
0 . 5
±
1 3
±
DIMENSIONS (mm)
Case
Type
Code
Size
D∅ ±2 W ±1.5 Qty/Reel
2.0
± 0.5
φ
φ
5
D
M i n .
B
C
D
FC/NC/PC
FA/NA/PA
FB
C
A
B
180
180
180
9.0
9.0
2000 pcs
2000 pcs
500 pcs
13.0
W
RECOMMENDED LAND PATTERNS FOR FLOW AND REFLOW SOLDERING
NIN Chip
Land Pattern
DIMENSIONS (mm)
C
Type
FC/NC/PC
FA/NA/PA
FB
Size
A
B
C
B
C
D
C
1.4~1.5 3.5~4.0 1.2~1.6
1.6~2.0 4.0~4.6 1.9~2.4
2.4~2.6 5.5~6.0 2.0~3.0
A
B
A
B
®
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37
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