Molded Chip Wirewound Inductors
DIMENSIONS (mm)
SIZE A and C
SIZE B
NIN Series
MARKING
MARKING
L
W
A
W
L
B
H
B
�½�½�½ �½�½�½�½
�½�½�½�½
�½�½�½�½
�½�½�½�½
�½�½�½�½ �½�½�½�½
�½
�½
�½
�½�½�½�½ �½
�½�½�½�½
�½�½�½
�½�½�½�½
�½�½�½ �½ �½�½�½
�½�½�½ �½ �½�½�½
�½�½�½�½ �½
�½�½�½ �½ �½�½�½
�½�½�½ �½ �½�½�½
�½�½�½ �½ �½�½�½
�½�½�½�½ �½
�½�½�½ �½ �½�½�½
�½�½�½ �½ �½�½�½
�½�½�½ �½ �½�½�½
�½�½�½�½ �½
�½�½�½ �½ �½�½�½
�½�½�½ �½ �½�½�½
�½�½�½ �½ �½�½�½
�½�½�½�½ �½
�½�½�½ �½ �½�½�½
�½�½�½ �½ �½�½�½
�½�½�½ �½ �½�½�½
PART MARKING
Inductance
Tolerance
±20%
±10%
±5%
Marking for
Tolerance
M
No Identification
J
Example
2R2M
470
270J
(1) 3 digits system in
µH
(2) R indicates decimal point in
µH
Ex:2R7 = 2.7µH
Ex:R18 = .18µH = 180nH
(3) N indicates nanohenries (0.001
µH),
Ex: 10N = 0.01
µH
= 10nH
Applicable Guidelines:
1. Recommended soldering conditions :
Flow (wave): 250
o
C for 5 sec. max. (preheating of 120
o
C for 5 minutes.)
Reflow: 250
o
C for 10 sec. max., total time above 230°C is 40 sec. max. (preheating 150°C ~ 180°C/120 sec. max.)
2. Avoid placing inductor over any metal pattern on the PCB, which may create mutual inductance problems.
3. For mounting, it is suggested to secure chip inductor by means of epoxy adhesive curable by ultraviolet.
4. Ultrasonic cleaning is not recommended. If it is necessary, the cleaning conditions must be examined so as not to create mechanical
damage by unexpected resonant vibration. Please contact our engineering department.
5. An excessive mechanical force may effect the electrical and magnetic properties of chip inductors. Make sure not to use any stress
greater than 2Kg when component is placed.
PART NUMBER SYSTEM
NIN-FA R47 M TR F
Lead Free/RoHS compliant
(99.3% Sn, 0.7% Cu)
Packaging: TR = Tape & Reel
Inductance Tolerance Code:
M = ±20%, K = ±10%, J = ±5%
Rated inductance in µH (3 digits, first 2 numbers
are significant, R stands for decimal point)
Series-Type
®
28
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
H
www.SMTmagnetics.com
A