µPD78P4038
13. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the µPD78P4038.
For details of the recommended soldering conditions, refer to our document Semiconductor Device Mounting
Technology Manual (C10535E).
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
different conditions.
Table 13-1. Soldering Conditions for Surface-Mount Devices (1/2)
(1) µPD78P4038GC-3B9: 80-pin plastic QFP (14 × 14 × 2.7 mm)
Soldering Process
Infrared ray reflow
Soldering Conditions
Symbol
IR35-00-3
Peak package's surface temperature: 235°C
Reflow time: 30 seconds or less (210°C or more)
Maximum allowable number of reflow processes: 3
VPS
Peak package's surface temperature: 215°C
Reflow time: 40 seconds or less (200°C or more)
Maximum allowable number of reflow processes: 3
VP15-00-3
WS60-00-1
Wave soldering
Solder temperature: 260°C or less
Flow time: 10 seconds or less
Number of flow processes: 1
Preheating temperature
: 120°C max. (measured on the package surface)
Partial heating method
Terminal temperature: 300°C or less
–
Heat time: 3 seconds or less (for one side of a device)
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
(2) µPD78P4038GC-8BT: 80-pin plastic QFP (14 × 14 × 1.4 mm)
Soldering Process
Infrared ray reflow
Soldering Conditions
Symbol
IR35-00-2
Peak package's surface temperature: 235°C
Reflow time: 30 seconds or less (210°C or more)
Maximum allowable number of reflow processes: 2
VPS
Peak package's surface temperature: 215°C
Reflow time: 40 seconds or less (200°C or more)
Maximum allowable number of reflow processes: 2
VP15-00-2
WS60-00-1
Wave soldering
Solder temperature: 260°C or less
Flow time: 10 seconds or less
Number of flow processes: 1
Preheating temperature
: 120°C max. (measured on the package surface)
Partial heating method
Terminal temperature: 300°C or less
–
Heat time: 3 seconds or less (for one side of a device)
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
59
NEC [ NEC ]
