µPD6121, 6122
11. RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product.
For more details, refer to the NEC document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY
MANUAL (IEI-1207).
Please consult an NEC sales representative in case an other soldering process is used, or in case soldering
is done under different conditions.
Table 11-1. Soldering Conditions for Surface Mounting
µPD6121G-001: 20-pin plastic SOP (375 mil)
µPD6121G-002: 20-pin plastic SOP (375 mil)
µPD6122G-001: 24-pin plastic SOP (375 mil)
µPD6122G-002: 24-pin plastic SOP (375 mil)
*
Soldering Process
Infrared ray reflow
Soldering Conditions
Symbol
Peak temperature of package surface: 230 °C,
Reflow time: 30 seconds or less (210 °C or higher),
Number of reflow processes: 1
IR30-00-1
VPS
Peak temperature of package surface: 215 °C,
Reflow time: 40 seconds or less (200 °C or higher),
Number of reflow processes: 1
VP15-00-1
WS60-00-1
—
Wave soldering
Partial heating
Solder temperature: 260 °C or lower,
Reflow time: 10 seconds or less, Number of reflow processes: 1
Preheat temperature: 120 °C or lower (at package surface)
Pin temperature: 300 °C or lower,
Time: 3 seconds or less (per device side)
Caution Do not apply more than one soldering method at any one time, except for the partial heating
method.
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NEC [ NEC ]
