µPD43256B
Recommended Soldering Conditions
The following conditions (See table below) must be met when soldering µPD43256B. For more details, refer
to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (C10535E).
Please consult with our sales offices in case other soldering process is used, or in case soldering is done
under different conditions.
Types of Surface Mount Device
µPD43256BGU: 28-pin plastic SOP (450 mil)
µPD43256BGW-9JL: 28-pin plastic TSOP (I) (8 × 13.4 mm) (Normal bent)
µPD43256BGW-9KL: 28-pin plastic TSOP (I) (8 × 13.4 mm) (Reverse bent)
Please consult with our sales offices.
Type of Through Hole Mount Device
µPD43256BCZ: 28-pin plastic DIP (600 mil)
Soldering process
Soldering conditions
Wave soldering
(only to leads)
Solder temperature: 260 ˚C or below,
Flow time: 10 seconds or below
Partial heating method
Terminal temperature: 300 ˚C or below,
Time: 3 seconds or below (Per one lead)
Caution Do not jet molten solder on the surface of package.
21
NEC [ NEC ]
