µPC2711TB, µPC2712TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
AMP-2
Top View
IN
OUT
C
C
Mounting direction
(Marking is an example for µPC2711TB)
VCC
C
COMPONENT LIST
Notes
1. 30 × 30 × 0.4 mm double sided copper clad polyimide board.
2. Back side: GND pattern
Value
3. Solder plated on pattern
C
1 000 pF
4.
: Through holes
For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATIONS
OF 6-PIN MINI-MOLD, 6-PIN SUPER MINI-MOLD SILICON HIGH-FREQUENCY WIDEBAND AMPLIFIER MMIC
(P11976E).
6
Data Sheet P11510EJ3V0DS00