µPC2711TB, µPC2712TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to VCC line.
(4) The DC cut capacitor must be each attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
Soldering Method
Infrared Reflow
Soldering Conditions
Recommended Condition Symbol
IR35-00-3
Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Count: 3, Exposure limitNote: None
VPS
Package peak temperature: 215°C or below
Time: 40 seconds or less (at 200°C)
Count: 3, Exposure limitNote: None
VP15-00-3
WS60-00-1
–
Wave Soldering
Partial Heating
Soldering bath temperature: 260°C or below
Time: 10 seconds or less
Count: 1, Exposure limitNote: None
Pin temperature: 300°C
Time: 3 seconds or less (per side of device)
Exposure limitNote: None
Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
16
Data Sheet P11510EJ3V0DS00
NEC [ NEC ]
