µPC2712T
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to prevent an increase in ground impedance (to prevent undesired
oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 1000 pF) to the VCC pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
µPC2712T
Recommended condition
Soldering method
Infrared ray reflow
Soldering conditions
symbols
Package peak temperature: 235 °C,
Hour: within 30 s. (more than 210 °C),
Time: 3 time, Limited days; no.*1
IR35-00-3
VPS
Package peak temperature: 215 °C,
Hour: within 40 s. (more than 200 °C),
Time: 3 time, Limited days: no.*1
VP15-00-3
WS60-00-1
Wave soldering
Pin part heating
Soldering tub temperature: less than 260 °C,
Hour: within 10 s.
Time: 1 time, Limited days: no.
Pin area temperature: less than 300 °C,
Hour: within 3 s.
Limited days: no.*1
*1 It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH.
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
9
NEC [ NEC ]
