PS2505-1,-2,-4,PS2505L-1,-2,-4
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature
• Time of temperature higher than 210 °C
• Number of reflows
235 °C (package surface temperature)
30 seconds or less
Three
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt % is recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
235 ˚C (peak temperature)
210 ˚C
to 30 s
120 to 160 ˚C
60 to 90 s
(preheating)
Time (s)
Caution Avoid removing the residual flux with chlorine-based cleaning solvent after a reflow process.
Peak temperature 235 ˚C or below
(2) Dip soldering
• Temperature
260 °C or below (molten solder temperature)
• Time
10 seconds or less
• Number of times
• Flux
One
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of
0.2 Wt % is recommended.)
10
NEC [ NEC ]
