Notice
2. Land Dimensions
Chip Capacitor
ꢀPlease confirm the suitable land dimension by
evaluating of the actual SET / PCB.
Land
b
a
Solder Resist
Table 1 Flow Soldering Method
ChipꢀDimension
(L/W)ꢀCode
Series
Chip(L×W)
1.6×0.8
a
b
c
GRT
GRT
GRT
18
21
31
0.6 to 1.0
1.0 to 1.2
2.2 to 2.6
0.8 to 0.9
0.9 to 1.0
1.0 to 1.1
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
2.0×1.25
3.2×1.6
Flow soldering can only be used for products with a chip size of 1.6x0.8mm to 3.2x1.6mm.
(in mm)
Resistance to PCB bending stress may be improved by designing the “a” dimension with solder resist.
Table 2 Reflow Soldering Method
Chip(L×W)
ChipꢀDimension
(L/W)ꢀCode
Series
GRT
(Dimensions
Tolerance)
0.6×0.3
a
b
c
0.2 to 0.25
0.2 to 0.25
0.23 to 0.3
0.3 to 0.5
0.4 to 0.6
0.6 to 0.8
0.7 to 0.9
1.2
0.2 to 0.3
0.25 to 0.35
0.25 to 0.35
0.35 to 0.45
0.4 to 0.5
0.6 to 0.7
0.7 to 0.8
0.6
0.25 to 0.35
0.3 to 0.4
0.3 to 0.4
0.4 to 0.6
0.5 to 0.7
0.6 to 0.8
0.8 to 1.0
1.25
(±0.03)
0.6×0.3
(±0.05)
0.6×0.3
(±0.09)
1.0×0.5
03
(within ±0.10)
1.0×0.5
(±0.15/±0.20）
1.6×0.8
(±0.10)
1.6×0.8
(±0.15/±0.20)
2.0×1.25
(±0.10)
GRT
GRT
15
18
2.0×1.25
(±0.15)
2.0×1.25
(±0.20)
GRT
21
1.2
0.6 to 0.8
0.6 to 0.8
1.2 to 1.4
1.2 to 1.4
1.0 to 1.4
3.2×1.6
(±0.20)
GRT
GRT
31
32
1.8 to 2.0
2.0 to 2.4
0.9 to 1.2
1.0 to 1.2
1.5 to 1.7
1.8 to 2.3
3.2×2.5
(in mm)
JEMCGC-01743G
26
MURATA [ muRata ]
