2. Land Dimensions
Chip Capacitor
ꢀPlease confirm the suitable land dimension by evaluating of the actual SET / PCB.
Land
b
a
Solder Resist
Table 1 Flow Soldering Method
Series
GRM
GRM
GRM
Chip Dimension(L/W) Code
Chip(L×W)
1.6×0.8
a
b
c
18
21
31
0.6 to 1.0
1.0 to 1.2
2.2 to 2.6
0.8 to 0.9
0.9 to 1.0
1.0 to 1.1
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
2.0×1.25
3.2×1.6
(in mm)
Resistance to PCB bending stress may be improved by designing the “a” dimension with solder resist.
Table 2 Reflow Soldering Method
Chip(L×W)
Series
Chip Dimension(L/W) Code
a
b
c
(Dimensions Tolerance)
GRM
GRM
GRM
01
02
0.25×0.125
0.10 to 0.11
0.16 to 0.2
0.17 to 0.23
0.07 to 0.12
0.12 to 0.18
0.22 to 0.28
0.125 to 0.145
0.2 to 0.23
0.4×0.2
MD
0.5×0.25
0.25 to 0.30
0.6×0.3
(+/-0.03)
0.6×0.3
(+/-0.05)
0.6×0.3
0.2 to 0.25
0.2 to 0.25
0.23 to 0.3
0.3 to 0.5
0.4 to 0.6
0.6 to 0.8
0.2 to 0.3
0.25 to 0.35
0.25 to 0.35
0.35 to 0.45
0.4 to 0.5
0.25 to 0.35
0.3 to 0.4
0.3 to 0.4
0.4 to 0.6
0.5 to 0.7
0.6 to 0.8
GRM
GRM
03
15
(+/-0.09)
1.0×0.5
(within +/-0.10)
1.0×0.5
（+/-0.15/+/-0.20）
1.6×0.8
(within +/-0.10)
1.6×0.8
(+/-0.15/+/-0.20)
0.6 to 0.7
GRM
GRM
18
0.7 to 0.9
0.8 to 0.9
1.2
0.7 to 0.8
0.6 to 0.8
0.6
0.8 to 1.0
0.9 to 1.1
1.25
JN
1.8×1.0
2.0×1.25
(within +/-0.10)
2.0×1.25
GRM
21
1.2
0.6 to 0.8
0.6 to 0.8
0.9 to 1.2
1.0 to 1.3
1.2 to 1.4
1.2 to 1.4
1.5 to 1.7
1.7 to 1.9
(+/-0.15)
2.0×1.25
(+/-0.20)
3.2×1.6
1.0 to 1.4
1.8 to 2.0
1.9 to 2.1
(within+/-0.20)
3.2×1.6
GRM
31
(+/-0.30)
GRM
GRM
GRM
32
43
55
3.2×2.5
4.5×3.2
5.7×5.0
2.0 to 2.4
3.0 to 3.5
4.0 to 4.6
1.0 to 1.2
1.2 to 1.4
1.4 to 1.6
1.8 to 2.3
2.3 to 3.0
3.5 to 4.8
(in mm)
GRM31CB31C226ME15-01A
MURATA [ muRata ]
