4-2.Flow Soldering
1. Do not apply flow soldering to chips not listed in Table 2.
[Standard Conditions for Flow Soldering]
Temperature(℃)
Soldering
Peak
Temperature
Table 2
Soldering
Temperature Differential
ΔT≦150℃
ChipꢀDimension(L/W)ꢀCode
Series
GRM
Gradual
Cooling
ΔT
18/21/31
Preheating
Peak
Temperature
Preheating
30 to 90 s
2. When sudden heat is applied to the components, the mechanical strength of the components will
decrease because a sudden temperature change causes deformation inside the components.
In order to prevent mechanical damage to the components, preheating is required for both of the
components and the PCB.
Time
5 s max.
Preheating conditions are shown in table 2.
It is required to keep the temperature differential between the solder and the components surface
(ΔT) as low as possible.
[Allowable Flow Soldering Temperature and Time]
280
270
260
3. Excessively long soldering time or high soldering temperature can result in leaching of the
terminations, causing poor adhesion or a reduction in capacitance value due to loss of contact
between the inner electrodes and terminations.
250
240
230
220
4. When components are immersed in solvent after mounting, be sure to maintain the temperature
differential (ΔT) between the component and solvent within the range shown in the table 2.
0
10
20
30
40
Soldering Time(s)
Recommended Conditions
Lead Free Solder
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Preheating Peak Temperature
Soldering Peak Temperature
100 to 120℃
250 to 260℃
Air or N2
Atmosphere
Lead Free Solder: Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
Up to Chip Thickness
5-1. The top of the solder fillet should be lower than the thickness of the components.
If the solder amount is excessive, the risk of cracking is higher during board
bending or any other stressful condition.
in section
Adhesive
GRM31CB31C226ME15-01A
MURATA [ muRata ]
