2. Land Dimensions
Please confirm the suitable land dimension by evaluating of the actual SET / PCB.
Table 1 Flow Soldering Method
Chip Dimension
Series
Chip(L×W)
a
b
c
(L/W) Code
GR□
GR□
GR□
18
21
31
1.6×0.8
2.0×1.25
3.2×1.6
0.6 to 1.0
1.0 to 1.2
2.2 to 2.6
0.8 to 0.9
0.9 to 1.0
1.0 to 1.1
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
Flow soldering can only be used for products with a chip size of 1.6x0.8mm to 3.2x1.6mm.
(in mm)
Resistance to PCB bending stress may be improved by designing the “a” dimension with solder resist.
Table 2 Reflow Soldering Method
Chip Dimension
Series
Chip(L×W)
a
b
c
(L/W) Code
GR□
GR□
GR□
GR□
GR□
GR□
GR□
GR□
18
21
31
32
42
43
52
55
1.6×0.8
2.0×1.25
3.2×1.6
3.2×2.5
4.5×2.0
4.5×3.2
5.7×2.8
5.7×5.0
0.6 to 0.8
1.0 to 1.2
1.8 to 2.0
2.0 to 2.4
2.8 to 3.4
3.0 to 3.5
4.0 to 4.6
4.0 to 4.6
0.6 to 0.7
0.6 to 0.7
0.9 to 1.2
1.0 to 1.2
1.2 to 1.4
1.2 to 1.4
1.4 to 1.6
1.4 to 1.6
0.6 to 0.8
1.2 to 1.4
1.5 to 1.7
1.8 to 2.3
1.4 to 1.8
2.3 to 3.0
2.1 to 2.6
3.5 to 4.8
(in mm)
< Applicable to beyond Rated Voltage of 200VDC >
2-2. Dimensions of Slit (Example)
L×W
d
-
-
e
-
-
1.6×0.8
2.0×1.25
3.2×1.6
3.2×2.5
4.5×2.0
4.5×3.2
5.7×2.8
5.7×5.0
Preparing the slit helps flux cleaning and resin coating on the back of the capacitor.
However, the length of the slit design should be as short as possible
to prevent mechanical damage in the capacitor.
A longer slit design might receive more severe mechanical stress from the PCB.
Recommended slit design is shown in the Table.
1.0 to 2.0
1.0 to 2.0
1.0 to 2.8
1.0 to 2.8
1.0 to 4.0
1.0 to 4.0
3.2 to 3.7
4.1 to 4.6
3.6 to 4.1
4.8 to 5.3
4.4 to 4.9
6.6 to 7.1
GRM31C5C2E223JWA3-00B
27
MURATA [ muRata ]
