Table A Capacitance Change between at Reference Temp. and at each Temp. (%)
-55℃
-30℃
-10℃
Char.
7U
Max.
8.78
Min.
5.04
Max.
6.04
Min.
3.47
Max.
3.84
Min.
2.21
Substrate Bending test
Except for Substrate Bending test
・Test substrate
Material
Thickness
・Test substrate
Material
Thickness
JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)
1.6mm
JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)
1.6mm
Copper Foil Thickness 0.035mm
Copper Foil Thickness 0.035mm
Kind of Solder
Sn-3.0Ag-0.5Cu(Lead Free Solder)
Kind of Solder
Sn-3.0Ag-0.5Cu(Lead Free Solder)
・Land Dimension
・Land Dimension
Dimension(mm)
b
Dimension(mm)
b
Type
Type
a
c
a
c
GRM31
2.2
5.0
2.0
GRM31
2.2
5.0
2.0
・Pressurization Method
GRM31B7U2J272JW31-00B
4
MURATA [ muRata ]
