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GRM2195C1H562JA01D 参数 Datasheet PDF下载

GRM2195C1H562JA01D图片预览
型号: GRM2195C1H562JA01D
PDF下载: 下载PDF文件 查看货源
内容描述: 片状独石陶瓷电容器 [Chip Monolithic Ceramic Capacitors]
分类和应用: 电容器陶瓷电容器
文件页数/大小: 221 页 / 4341 K
品牌: MURATA [ muRata ]
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• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our  
C02E.pdf  
!Note  
sales representatives or product engineers before ordering.  
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.  
10.12.20  
GQM Series Specifications and Test Methods  
Continued from the preceding page.  
Specifications  
No.  
Item  
Test Method  
Appearance  
No defects or abnormalities.  
Solder the capacitor on the test jig (glass epoxy board) shown  
in Fig. 2 using a eutectic solder.  
Then apply a force in the direction shown in Fig. 3.  
The soldering should be done by the reflow method and should  
be conducted with care so that the soldering is uniform and free  
of defects such as heat shock.  
Capacitance  
Change  
Within T5% or T0.5pF  
(whichever is larger)  
b
c
φ4.5  
20  
Pressurizing  
50  
speed: 1.0mm/sec.  
a
Pressurize  
12 Deflection  
100  
R230  
t: 1.6mm  
Flexure : V1  
Type  
a
b
c
GQM18  
GQM21  
GQM22  
1.0  
1.2  
2.2  
3.0  
4.0  
5.0  
1.2  
1.65  
2.9  
Capacitance meter  
45 45  
(in mm)  
Fig. 3  
Fig. 2  
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and  
rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at  
80 to 120D for 10 to 30 seconds. After preheating, immerse in  
eutectic solder solution for 2T0.5 seconds at 230T5D or  
Sn-3.0Ag-0.5Cu solder solution for 2T0.5 seconds at 245T5°C.  
Solderability of  
Termination  
75% of the terminations are to be soldered evenly  
and continuously.  
13  
The measured and observed characteristics should satisfy the  
specifications in the following table.  
Appearance  
No defects or abnormalities.  
Capacitance  
Change  
Within T2.5% or T0.25 pF  
(whichever is larger)  
Preheat the capacitor at 120 to 150D for 1 minute. Immerse the  
capacitor in a eutectic solder or Sn-3.0Ag-0.5Cu solder solution  
at 270T5D for 10T0.5 seconds. Let sit at room temperature for  
24T2 hours, then measure.  
Resistance  
14 to Soldering  
Heat  
30pF and over: QU1400  
30pF and below: QU800W20C  
Q
C: Nominal Capacitance (pF)  
I.R.  
More than 10,000MΩ  
Dielectric  
Strength  
No defects.  
The measured and observed characteristics should satisfy the  
specifications in the following table.  
Fix the capacitor to the supporting jig in the same manner and  
under the same conditions as (10).  
Perform the five cycles according to the four heat treatments  
listed in the following table.  
Appearance  
No defects or abnormalities.  
Capacitance  
Change  
Within T2.5% or T0.25pF  
(whichever is larger)  
Temperature  
Let sit for 24T2 hours at room temperature, then measure.  
30pF and over: QU1400  
30pF and below: QU800W20C  
15  
Cycle  
Step  
1
2
3
4
Q
Min. Operating  
Temp. W0/Y3  
Max. Operating  
Temp. W3/Y0  
Room  
Temp.  
Room  
Temp.  
Temp. (D)  
C: Nominal Capacitance (pF)  
30T3  
30T3  
Time (min.)  
2 to 3  
2 to 3  
I.R.  
More than 10,000MΩ  
Dielectric  
Strength  
No defects.  
The measured and observed characteristics should satisfy the  
specifications in the following table.  
Appearance  
No defects or abnormalities.  
Capacitance  
Change  
Within T5% or T0.5pF  
(whichever is larger)  
Set the capacitor at 40T2D and in 90 to 95% humidity for  
500T12 hours.  
Humidity  
16 Steady  
State  
30pF and over: QU350  
10pF and over, 30pF and below: QU275+5C/2  
10pF and below: QU200W10C  
Remove and set for 24T2 hours at room temperature, then  
measure.  
Q
C: Nominal Capacitance (pF)  
I.R.  
More than 1,000MΩ  
Continued on the following page.  
109