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• This PDF catalog is downloadedand
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(forMurata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
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sales representatives or product engineers before ordering.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
10.12.20
for Bonding GMD Series
s
Features
1. Small chip size (LxWxT: 0.6x0.3x0.3, 1.0x0.5x0.5mm)
2. Available for Wire/Die bonding due to
Gold termination.
3. Suitable for Optical device for telecommunication,
built-in IC packaging.
e
g
e
Outer electrode: Au
L
W
s
Applications
1. Optical device for telecommunication
2. IC, built-in IC packaging
Part Number
GMD033
GMD155
119
Product Information
For Bonding
GMD Series
Monolithic Microchip
GMA Series
High Frequency
GQM Series
High-Q
GJM Series
Low ESL
LLp Series
L
0.6±0.03
1.0±0.05
Dimensions (mm)
W
T
e
g min.
0.3±0.03 0.3±0.03 0.12 to 0.22 0.16
0.5±0.05 0.5±0.05 0.15 to 0.35
0.3
Array
GNM Series
T
For General
GRM Series
Chip Monolithic Ceramic Capacitors
MURATA [ MURATA MANUFACTURING CO., LTD. ]
