Notice
2. Land Dimensions
Chip Capacitor
2-1. Chip capacitors can be cracked due to the stress
of PCB bending , etc. if the land area is larger than
needed and has an excess amount of solder.
Please refer to the land dimensions in table 1
for flow soldering, table 2 for reflow soldering.
Land
Please confirm the suitable land dimension by
evaluating of the actual SET / PCB.
b
a
Solder Resist
Table 1 Flow Soldering Method
ChipꢀDimension
(L/W)ꢀCode
Series
GRM
GRM
GRM
Chip(L×W)
a
b
c
18
1.6×0.8
2.0×1.25
3.2×1.6
0.6 to 1.0
1.0 to 1.2
2.2 to 2.6
0.8 to 0.9
0.9 to 1.0
1.0 to 1.1
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
21
31
Flow soldering can only be used for products with a chip size of 1.6x0.8mm to 3.2x1.6mm.
(in mm)
Table 2 Reflow Soldering Method
Chip(L×W)
(Dimensions
Tolerance)
ChipꢀDimension
(L/W)ꢀCode
Series
GRM
a
b
c
01
0.25×0.125
0.10 to 0.11
0.07 to 0.12
0.125 to 0.145
GRM
GRM
02
03
0.4×0.2
0.6×0.3
0.16 to 0.2
0.2 to 0.3
0.3 to 0.5
0.4 to 0.6
0.6 to 0.8
0.7 to 0.9
1.2
0.12 to 0.18
0.2 to 0.35
0.35 to 0.45
0.4 to 0.5
0.6 to 0.7
0.7 to 0.8
0.6
0.2 to 0.23
0.2 to 0.4
0.4 to 0.6
0.5 to 0.7
0.6 to 0.8
0.8 to 1.0
1.25
1.0×0.5
(within ±0.10)
1.0×0.5
（±0.15/±0.20）
1.6×0.8
(within ±0.10)
1.6×0.8
(±0.15/±0.20)
2.0×1.25
(within ±0.10)
2.0×1.25
(±0.15)
2.0×1.25
GRM
GRM
15
18
GRM
GRM
21
31
1.2
0.6 to 0.8
0.6 to 0.8
0.9 to 1.2
1.0 to 1.3
1.0 to 1.2
1.2 to 1.4
1.4 to 1.6
1.2 to 1.4
1.2 to 1.4
1.5 to 1.7
1.7 to 1.9
1.8 to 2.3
2.3 to 3.0
3.5 to 4.8
1.0 to 1.4
1.8 to 2.0
1.9 to 2.1
2.0 to 2.4
3.0 to 3.5
4.0 to 4.6
(±0.20)
3.2×1.6
(within±0.20)
3.2×1.6
(±0.30)
GRM
GRM
GRM
32
43
55
3.2×2.5
4.5×3.2
5.7×5.0
(in mm)
JEMCGC-2701X
26
MURATA [ muRata ]
