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GRM188R61H684KA75 参数 Datasheet PDF下载

GRM188R61H684KA75图片预览
型号: GRM188R61H684KA75
PDF下载: 下载PDF文件 查看货源
内容描述: [Chip Multilayer Ceramic Capacitors for General Purpose]
分类和应用:
文件页数/大小: 30 页 / 796 K
品牌: MURATA [ muRata ]
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3. Board Design  
When designing the board, keep in mind that the amount of strain which occurs will increase  
depending on the sizeand material of the board.  
Relationship with amount of strain to the board thickness, length, width, etc.]  
3PL  
Relationshipbetweenloadandstrain  
ε=  
2Ewh2  
εStrain on center of board (μst)  
LDistance between supporting points (mm)  
P
Y
w
h
E
Y
P
Board width (mm)  
Board thickness (mm)  
Elastic modulus of board (N/m2=Pa)  
Deflection (mm)  
h
Load (N)  
w
L
When the load is constant, the following relationship can be established.  
· As the distance between the supporting points (L) increases,the amount of strain also increases.  
→Reduce the distance between the supporting points.  
· As the elastic modulus (E) decreases, the amount of strain increases.  
→Increase the elastic modulus.  
·
As the board width (w) decreases, the amount of strain increases.  
→Increase the width of the board.  
As the board thickness (h) decreases, the amount of strain increases.  
·
→Increase the thickness of the board.  
Since the board thickness is squared, the effect on the amount of strain becomes even greater.  
GRM188R61H684KA75-01A  
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