Table A Capacitance Change between at Reference Temp. and at each Temp. (%)
-55℃
-25℃
-10℃
Char.
3C
Max.
1.37
Min.
-0.9
Max.
0.82
Min.
-0.54
Max.
0.55
Min.
-0.36
Substrate Bending test
Except for Substrate Bending test
・Test substrate
Material
Thickness
・Test substrate
Material
Thickness
JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)
1.6mm
JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)
1.6mm or 0.8mm
Copper Foil Thickness 0.035mm
Copper Foil Thickness 0.035mm
Kind of Solder
Sn-3.0Ag-0.5Cu(Lead Free Solder)
Kind of Solder
Sn-3.0Ag-0.5Cu(Lead Free Solder)
・Land Dimension
・Land Dimension
Dimension(mm)
b
Dimension(mm)
b
Type
Type
a
c
a
c
GRM18
1.0
3.0
1.2
GRM18
1.0
3.0
1.2
・Pressurization Method
GRM1883C1H3R4WA01-01A
5
MURATA [ muRata ]
