Table A Capacitance Change between at Reference Temp. and at each Temp. (%)
-55℃
-30℃
-10℃
Char.
5C
Max.
0.58
Min.
-0.24
Max.
0.4
Min.
-0.17
Max.
0.25
Min.
-0.11
Substrate Bending test
Except for Substrate Bending test
・Test substrate
Material
Thickness
・Test substrate
Material
Thickness
JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)
0.8mm
JIS C 6484 Copper-clad laminated sheets for PCBs (Glass fabric base, epoxy resin)
1.6mm or 0.8mm
Copper Foil Thickness 0.035mm
Copper Foil Thickness 0.035mm
Kind of Solder
Sn-3.0Ag-0.5Cu(Lead Free Solder)
Kind of Solder
Sn-3.0Ag-0.5Cu(Lead Free Solder)
・Land Dimension
・Land Dimension
Dimension(mm)
b
Dimension(mm)
b
Type
Type
a
c
a
c
GRM15
0.4
1.5
0.5
GRM15
0.4
1.5
0.5
・Pressurization Method
GRM1555C1H5R7CA01-01A
5
MURATA [ muRata ]
