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!Note
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C02E.pdf
10.12.20
sales representatives or product engineers before ordering.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Reference Data
1. Solderability
(1) Test Method
(2) Test Samples
Subject the chip capacitor to the following conditions.
Then apply flux (an ethanol solution of 25% rosin) to the
chip and dip it in 230D eutectic solder for 2 seconds.
Conditions:
GRM21 : Products for flow/reflow soldering.
(3) Acceptance Criteria
With a 60-power optical microscope, measure the surface
area of the outer electrode that is covered with solder.
(4) Results
Expose prepared at room temperature (for 6 months and
12 months, respectively)
Refer to Table 1.
Prepared at high temperature (for 100 hours at 85D)
Prepared left at high humidity (for 100 hours under
90%RH to 95%RH at 40D)
Table 1
Prepared at High
Temperature for
100 Hours at 85D
Prepared at High Humidity
for 100 Hours at 90 to
95% RH and 40D
Prepared at Room Temperature
Sample
Initial State
6 months
12 months
GRM21 for flow/reflow soldering
95 to 100%
95 to 100%
95%
90 to 95%
95%
2. Board Bending Strength for Solder Fillet Height
(1) Test Method
Solder the chip capacitor to the test PCB with the amount
of solder paste necessary to achieve the fillet heights.
Then bend the PCB using the method illustrated and
measure capacitance.
50
20
Pressurizing
Speed: 1.0mm/sec.
Pressurize
Capacitor
Note : The material of pressure application jig and
support is the quenched metal.
R230
Supporting
Base
45
45
(hardness HB 183
HRA90 or more)
-255 or superhardness
Flexure
Capacitance Meter
Solder Amount
1.2
Larger Fillet.
Fillet up to Chip
Thickness
4.0
1.6
100
Material : Glass Epoxy
: Copper Foil (0.35mm thick)
: Solder Resist
(in mm)
(2) Test Samples
GRM21: 5C/R7/F5 Characteristics T=0.6mm
(3) Acceptance Criteria
Products should be determined to be defective if the
change in capacitance has exceeded the values specified
in Table 2.
Table 2
Characteristics
Change in Capacitance
Within T5% or T0.5pF, whichever is greater
Within T12.5%
1
5C
R7
F5
Within T20%
Continued on the following page.
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MURATA [ muRata ]
