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!Note
!Note
C02E.pdf
10.12.20
sales representatives or product engineers before ordering.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Chip Monolithic Ceramic Capacitors
for Bonding GMD Series
e
g
e
■ Features
1. Small chip size (LxWxT: 0.6x0.3x0.3, 1.0x0.5x0.5mm)
2. Available for Wire/Die bonding due to
Gold termination.
Outer electrode: Au
3. Suitable for Optical device for telecommunication,
built-in IC packaging.
L
W
■ Applications
1. Optical device for telecommunication
Dimensions (mm)
T
0.6±0.03 0.3±0.03 0.3±0.03 0.12 to 0.22 0.16
1.0±0.05 0.5±0.05 0.5±0.05 0.15 to 0.35 0.3
Part Number
L
W
e
g min.
GMD033
GMD155
2. IC, built-in IC packaging
119
MURATA [ muRata ]
