2. Land Dimensions
Please confirm the suitable land dimension by evaluating of the actual SET / PCB.
Table 1 Flow Soldering Method
Chip Dimension
Series
Chip(L×W)
a
b
c
(L/W) Code
GQM
GQM
18
21
1.6×0.8
2.0×1.25
0.6 to 1.0
1.0 to 1.2
0.8 to 0.9
0.9 to 1.0
0.6 to 0.8
0.8 to 1.1
Flow soldering can only be used for products with a chip size of 1.6x0.8mm to 2.0x1.25mm.
(in mm)
Resistance to PCB bending stress may be improved by designing the “a” dimension with solder resist.
Table 2 Reflow Soldering Method
Chip Dimension
(L/W) Code
15
Chip(L×W)
(Dimensions Tolerance)
1.0×0.5(±0.05)
1.6×0.8(±0.10)
1.6×0.8(±0.15)
2.0×1.25
Series
GQM
GQM
a
b
c
0.3 to 0.5
0.6 to 0.8
0.7 to 0.9
1.0 to 1.2
2.2 to 2.5
0.35 to 0.45
0.6 to 0.7
0.7 to 0.8
0.6 to 0.7
0.8 to 1.0
0.4 to 0.6
0.6 to 0.8
0.8 to 1.0
0.8 to 1.1
1.9 to 2.3
18
GQM
GQM
21
22
2.8×2.8
(in mm)
GQM1875C2E9R6CB12-01A
25
MURATA [ muRata ]
