4-2. Flow Soldering
1. Do not apply flow soldering to chips not listed in Table 2.
[ Standard Conditions for Flow Soldering ]
Table 2
Series
Chip Dimension(L/W) Code
18/21
Temperature Differential
GQM
ΔT≦150℃
(Except for Temperature Characteristics:5G(X8G))
2. When sudden heat is applied to the components, the mechanical strength of the components will decrease
because a sudden temperature change causes deformation inside the components.
In order to prevent mechanical damage to the components, preheating is required for both of the components and the PCB.
Preheating conditions are shown in table 2.
It is required to keep the temperature differential between the solder and the components surface (ΔT) as low as possible.
[ Allowable Flow Soldering Temperature and Time ]
3. Excessively long soldering time or high soldering temperature can result in leaching of the terminations,
causing poor adhesion or a reduction in capacitance value due to loss of contact between the inner electrodes and terminations.
4. When components are immersed in solvent after mounting, be sure to maintain the temperature differential (ΔT)
between the component and solvent within the range shown in the table 2.
Recommended Conditions
Item
Lead Free Solder
Preheating Peak
Temperature
Soldering Peak
Temperature
100 to 120℃
250 to 260℃
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Air or N2
Atmosphere
Lead Free Solder: Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the thickness of the components.
If the solder amount is excessive, the risk of cracking is higher during board bending or any other stressful condition.
GQM1875C2E9R6CB12-01A
16
MURATA [ muRata ]
