7. Die Bonding/Wire Bonding
1. Die Bonding of Capacitors
ꢀ1-1. Use the following materials for the Brazing alloys: 80Au-20Sn 300 °C to 320°C in N2 atmosphere
ꢀ
ꢀ1-2. Mounting
(1) Control the temperature of the substrate so it matches the temperature of the brazing alloy.
(2) Place the brazing alloy on the substrate and place the capacitor on the alloy. Hold the capacitor and gently apply the load. Be sure to complete the operation within 1 minute.
ꢀ
2. Wire Bonding
2-1. Wire
ꢀꢀꢀ Gold wire: 25μm (0.001 inch) diameter
2-2. Bonding
(1) Thermo compression, ultrasonic ball bonding.
(2) Required stage temperature: 150°C to 200 °C
(3) Required wedge or capillary weight: 0.2N to 0.5N
(4) Bond the capacitor and base substrate or other devices with gold wire.
GMD033R11E181MA01-01A
18
MURATA [ muRata ]
