■ Specifications and Test Methods
No Item
Specification
Test Method(Ref. Standard:JIS C 5101, IEC60384）
MIL-STD-883 Method 2011 Condition D
Mount the capacitor on a gold metalized alumina substrate with Au-20Sn
and bond a φ25μm(φ0.001 inch) gold wire
Pull force : 0.03N min.
9 Adhesive Strength
(Wire Bonding)
to the capacitor terminal using an ultrasonic ball bond. Then, pull wire.
Die Shear force : 2N min.
MIL-STD-883 Method 2019
Mount the capacitor on a gold metalized alumina substrate with Au-20Sn.
Apply the force parallel to the substrate.
10 Adhesive Strength
(Die Bonding)
Appearance
Capacitance
Q or D.F.
No defects or abnormalities.
Within the specified initial value.
Within the specified initial value.
Mounting method
Kind of Vibration
Vibration Time
Mount the capacitor on the substrate using die bonding and wire bonding.
A simple harmonic motion 10Hz to 55Hz to 10Hz
1min
11 Vibration
Total amplitude
1.5mm
Vibration directions and time
This motion should be applied for a period of 2hours in each 3 mutually
perpendicular directions(total of 6hours).
Appearance
Capacitance Change
Q or D.F.
I.R.
Voltage proof
No defects or abnormalities.
Within +/-7.5%
Within the specified initial value.
Within the specified initial value.
No defects or abnormalities.
Mounting method
Pre-treatment
Mount the capacitor on the substrate using die bonding and wire bonding.
Heat treatment:Perform a heat treatment at 150+0/-10°C for 1hour and then let sit for 24+/-2hours
at room temperature, then measure.
12 Temperature Sudden
Change
Cycles
Temperature Cycling
5cycles
Post-treatment
Non treatment:Let sit for 24+/-2hours at room temperature, then measure.
Appearance
Capacitance Change
Q or D.F.
No defects or abnormalities.
Within +/-12.5%
DF≦0.05
Mounting method
Test Temperature
Test Humidity
Test Time
Mount the capacitor on the substrate using die bonding and wire bonding.
40+/-2℃
90%RH to 95%RH
500+/-12h
13 High Temperature High
Humidity (Steady)
I.R.
More than 500MΩ
Test Voltage
Rated Voltage
Charge/discharge current 50mA max.
Post-treatment
Non treatment:Let sit for 24+/-2hours at room temperature, then measure.
Appearance
Capacitance Change
Q or D.F.
No defects or abnormalities.
Within +/-12.5%
DF≦0.05
Mounting method
Pre-treatment
Mount the capacitor on the substrate using die bonding and wire bonding.
Voltage treatment:Apply the test voltage at the test temperature for 1hour and then let sit for
24+/-2hours at room temperature, then measure.
Maximum Operating Temperature +/-3℃
14 Durability
I.R.
More than 1000MΩ
Test Temperature
Test Time
1000+/-12h
Test Voltage
200% of the rated voltage
Charge/discharge current 50mA max.
Post-treatment
Non treatment:Let sit for 24+/-2hours at room temperature, then measure.
GMD033B11E122MA01-01A
3
MURATA [ muRata ]
