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GJM1555C1H7R6CB01 参数 Datasheet PDF下载

GJM1555C1H7R6CB01图片预览
型号: GJM1555C1H7R6CB01
PDF下载: 下载PDF文件 查看货源
内容描述: [Chip Monolithic Ceramic Capacitor High-Q Type for General]
分类和应用:
文件页数/大小: 25 页 / 723 K
品牌: MURATA [ muRata ]
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Caution  
(1) Example of a suitable jig  
[In the case of Single-side Mounting]  
An outline of the board separation jig is shown as follows.  
Recommended example: Stress on the component mounting position can be minimized by holding the  
portion close to the jig, and bend in the direction towards the side where the capacitors are mounted.  
Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress  
being applied to the component mounting position, if the portion away from the jig is held and bent in the  
direction opposite the side where the capacitors are mounted.  
[Outline of jig]  
[Hand Separation]  
Recommended  
Not recommended  
Direction of  
load  
Direction of load  
Load point  
Printed Circuit Board  
Printed circuit  
board  
V-groove  
Component  
Components  
Printed circuit  
board  
Load point  
Board Cropping Jig  
[In the case of Double-sided Mounting]  
Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the  
above method. Therefore, implement the following measures to prevent stress from being applied to the components.  
(Measures)  
(1) Consider introducing a router type separator.  
If it is difficult to introduce a router type separator, implement the following measures.  
(Refer to item 1. Mounting Position)  
(2) Mount the components parallel to the board separation surface.  
(3) When mounting components near the board separation point, add slits in the separation position  
near the component.  
(4) Keep the mounting position of the components away from the board separation point.  
(2) Example of a Disc Separator  
An outline of a disc separator is shown as follows. As shown in the Principle of Operation, the top  
blade and bottom blade are aligned with the V-grooves on the printed circuit board to separate the board.  
In the following case, board deflection stress will be applied and cause cracks in the capacitors.  
(1) When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom,  
left-right or front-rear directions  
(2) The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned  
top-bottom  
IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of the  
V groove with consideration about strength of material of the printed circuit board.  
[ Outline of Machine ]  
Top Blade  
[ Principle of Operation ]  
Top Blade  
[ Cross-section Diagram ]  
Printed Circuit Board  
V-groove  
Bottom Blade  
Printed Circuit Board  
[Disc Separator]  
Recommended  
Top Blade  
V-groove  
Not recommended  
Top-bottom Misalignment Left-right Misalignment  
Front-rear Misalignment  
Top Blade  
Top Blade  
Top Blade  
Bottom Blade  
Bottom Blade  
Bottom Blade  
Bottom Blade  
[V-groove Design]  
Example of Recommended  
Not Recommended  
Low-Angle  
Depth too Shallow  
V-groove Design  
Left-right Misalignment  
Depth too Deep  
JEMCGC-2703M  
17  
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