2. Land Dimensions
Please confirm the suitable land dimension by evaluating of the actual SET / PCB.
Table 1 Flow Soldering Method
Chip Dimension
Series
Chip(L×W)
a
b
c
(L/W) Code
GC□
GC□
GC□
18
21
31
1.6×0.8
2.0×1.25
3.2×1.6
0.6 to 1.0
1.0 to 1.2
2.2 to 2.6
0.8 to 0.9
0.9 to 1.0
1.0 to 1.1
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
Flow soldering can only be used for products with a chip size of 1.6x0.8mm to 3.2x1.6mm.
(in mm)
Resistance to PCB bending stress may be improved by designing the “a” dimension with solder resist.
Table 2 Reflow Soldering Method
Chip Dimension
(L/W) Code
Chip(L×W)
(Dimensions Tolerance)
0.6×0.3 (±0.03)
Series
GC□
GC□
GC□
GC□
a
b
c
0.2 to 0.25
0.23 to 0.3
0.3 to 0.5
0.4 to 0.6
0.6 to 0.8
0.7 to 0.9
1.2
1.0 to 1.4
1.8 to 2.0
1.9 to 2.1
2.0 to 2.4
0.2 to 0.3
0.25 to 0.35
0.35 to 0.45
0.4 to 0.5
0.6 to 0.7
0.7 to 0.8
0.6 to 0.8
0.6 to 0.8
0.9 to 1.2
1.0 to 1.3
1.0 to 1.2
0.25 to 0.35
0.3 to 0.4
0.4 to 0.6
0.5 to 0.7
0.6 to 0.8
0.8 to 1.0
1.2 to 1.4
1.2 to 1.4
1.5 to 1.7
1.7 to 1.9
1.8 to 2.3
03
15
18
21
0.6×0.3 (±0.09)
1.0×0.5 (within ±0.10)
1.0×0.5 （±0.20）
1.6×0.8 (±0.10)
1.6×0.8 (±0.20)(±0.25)
2.0×1.25 (±0.15)
2.0×1.25 (±0.20)
3.2×1.6 (within ±0.20)
3.2×1.6 (±0.30)
GC□
GC□
31
32
3.2×2.5
(in mm)
GCM1555C1H820JA16-01A
26
MURATA [ muRata ]
