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GCM1555C1H820JA16# 参数 Datasheet PDF下载

GCM1555C1H820JA16#图片预览
型号: GCM1555C1H820JA16#
PDF下载: 下载PDF文件 查看货源
内容描述: [汽车[动力总成 / 安全设备],汽车[信息娱乐 / 舒适设备],植入式以外的医疗器械设备 [GHTF A/B/C]]
分类和应用: 医疗医疗器械
文件页数/大小: 31 页 / 1834 K
品牌: MURATA [ muRata ]
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4-2. Flow Soldering  
1. Do not apply flow soldering to chips not listed in Table 2.  
[ Standard Conditions for Flow Soldering ]  
Table 2  
Series  
Chip Dimension(L/W) Code  
18/21/31  
Temperature Differential  
GC□  
ΔT150℃  
(Except for Temperature Characteristics:0C(-),5G(-),R9(X8R),L8(-),M8(-))  
2. When sudden heat is applied to the components, the mechanical strength of the components will decrease  
ꢀꢀbecause a sudden temperature change causes deformation inside the components.  
ꢀꢀIn order to prevent mechanical damage to the components, preheating is required for both of the components and the PCB.  
ꢀꢀPreheating conditions are shown in table 2.  
ꢀꢀIt is required to keep the temperature differential between the solder and the components surface (ΔT) as low as possible.  
3. Excessively long soldering time or high soldering temperature can result in leaching of the terminations,  
ꢀꢀcausing poor adhesion or a reduction in capacitance value due to loss of contact between the inner electrodes and terminations.  
[ Allowable Flow Soldering Temperature and Time ]  
4. When components are immersed in solvent after mounting, be sure to maintain the temperature differential (ΔT)  
ꢀꢀbetween the component and solvent within the range shown in the table 2.  
Recommended Conditions  
Item  
Pb-Sn Solder  
Lead Free Solder  
Preheating Peak  
Temperature  
Soldering Peak  
Temperature  
90 to 110℃  
100 to 120℃  
240 to 250℃  
250 to 260℃  
Air or N2  
Atmosphere  
Air  
Pb-Sn Solder : Sn-37Pb  
Lead Free Solder : Sn-3.0Ag-0.5Cu  
In the case of repeated soldering, the accumulated  
soldering time must be within the range shown above.  
5. Optimum Solder Amount for Flow Soldering  
5-1. The top of the solder fillet should be lower than the thickness of the components.  
If the solder amount is excessive, the risk of cracking is higher during board bending or any other stressful condition.  
GCM1555C1H820JA16-01A  
17  
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