A ꢀ ꢀ ꢁ ꢂ ꢃ Aꢄ ꢂ ꢅ ꢆ S ꢀ E ꢃ ꢂ F ꢂ ꢃ ꢃ A ꢀAꢃ ꢂ ꢄꢅ R S
High Frequency Ceramic Capacitors
ERB Soldering and Mounting
6. Correction with a Soldering Iron
(1) For Chip Type Capacitors
Table 3
When sudden heat is applied to the components by
soldering iron, the mechanical strength of the
Temperature
Differential
Peak
Temperature
Part Number
Atmosphere
components should go down because remarkable
temperature change causes deformity inside components.
In order to prevent mechanical damage in the
GRM15/18/21/31
GJM15
300°C max.
3 seconds max.
/ termination
ERB18/21
LLL15/18/21/31
∆TV190D
∆TV130D
Air
components, preheating should be required for both of
the components and the PCB board. Preheating
conditions are shown in Table 3. It is required to keep
temperature differential between the soldering and the
components surface (∆T) as small as possible. After
soldering, it is not allowed to cool it down rapidly.
GQM18/21
ERB18/21
GRM32/43/55
GNM
270°C max.
3 seconds max.
/ termination
ERB32
LLA18/21/31
Air
LLM21/31
ERB32
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Optimum Solder Amount when Corrections Are Made
Using a Soldering lron
The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessively big, the risk of cracking is higher during
board bending or under any other stressful conditions.
Soldering iron ø3mm or smaller should be required. And
it is necessary to keep a distance between the soldering
iron and the components without direct touch. Thread
solder with ø0.5mm or smaller is required for soldering.
Up to Chip Thickness
7. Washing
Excessive output of ultrasonic oscillation during cleaning
causes PCBs to resonate, resulting in cracked chips or
broken solder. Take note not to vibrate PCBs.
FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY
RESULT, WORST CASE, IN A SHORT CIRCUIT AND
FUMING WHEN THE PRODUCT IS USED.
Innovator in Electronics – 61
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MURATA [ muRata ]
