MP6401 – 300mA LDO LINEAR REGULATOR WITH INTEGRATED RESET IC
PACKAGE REFERENCE
TOP VIEW
TOP VIEW
TOP VIEW
8
7
6
5
IN
IN
1
2
3
4
OUT
EN
GND
IN
1
2
3
6
5
4
RESET
ADJ
IN
GND
EN
1
2
3
6
5
4
OUT
OUT
ADJ
GND
EN
ADJ
RESET
OUT
RESET
TSOT23-6
TQFN8 (3mm x 3mm)
TQFN6 (2mm x 2mm)
ABSOLUTE MAXIMUM RATINGS (1)
Thermal Resistance (4)
θJA
θJC
TQFN8 (3mm x 3mm) ...........48 ...... 11...°C/W
TQFN6 (2mm x 2mm) ...........80 ...... 16...°C/W
TSOT .....................................220 .... 110..°C/W
IN, EN, OUT.................................–0.3V to + 6 V
ADJ..................................................–0.3V to 6V
RESET.............................................–0.3V to 6V
(2)
Continuous Power Dissipation. (TA = +25°C)
Notes:
TQFN8 (3mm x 3mm) .............................. 2.6W
TQFN6 (2mm x 2mm) ............................ 1.56W
TSOT ....................................................... 0.57W
Junction Temperature...............................150°C
Lead Temperature ....................................260°C
Storage Temperature.............. –65°C to +150°C
Recommended Operating Conditions (3)
Supply Voltage VIN ..........................2.5V to 5.5V
Operating Junct. Temp (TJ)..... –40°C to +125°C
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum
junction
temperature
TJ
(MAX),
the
junction-to-ambient thermal resistance θJA, and the ambient
temperature TA. The maximum allowable continuous power
dissipation at any ambient temperature is calculated by PD
(MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable
power dissipation will cause excessive die temperature, and
the regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage. Thermal shutdown engages at TJ=150oC(TYP) and
disengages at TJ=130oC(TYP)
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7 4-layer board.
MP6401 Rev. 1.0
9/7/2012
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