MP175 – NON-ISOLATED OFFLINE REGULATOR
THERMAL RESISTANCE (4) ΘJA ΘJC
SOIC-8................................... 76......35 .... °C/W
ABSOLUTE MAXIMUM RATINGS (1)
DRAIN to GND..............................-0.3V to 700V
VCC to GND ...................................-0.3V to 30V
FB to GND .....................................-0.3V to 6.5V
NOTES:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ(MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowance continuous power dissipation at
any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-
TA)/θJA. Exceeding the maximum allowance power dissipation
produces an excessive die temperature, causing the regulator
to go into thermal shutdown. Internal thermal shutdown circuit
protects the device from permanent damage.
(2)
Continuous power dissipation (TA = +25°C)
SOIC-8..................................................... 1.64W
Junction temperature................................150°C
Lead temperature .....................................260°C
Storage temperature................ -60°C to +150°C
ESD capability human body mode............ 2.0kV
ESD charged device model ...................... 2.0kV
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.
Recommended Operating Conditions (3)
Operating junction temp. (TJ)... -40°C to +125°C
MP175 Rev. 1.0
4/10/2018
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