TM
MP1423 – 3A, 23V, 385KHz STEP-DOWN CONVERTER
PACKAGE INFORMATION
SOIC8N (EXPOSED PAD)
0.229(5.820)
0.244(6.200)
PIN 1 IDENT.
NOTE 4
0.150(3.810)
0.157(4.000)
0.0075(0.191)
0.0098(0.249)
SEE DETAIL "A"
NOTE 2
0.011(0.280)
0.020(0.508)
x 45o
0.013(0.330)
0.020(0.508)
0.050(1.270)BSC
0o-8o
0.016(0.410)
0.050(1.270)
DETAIL "A"
NOTE 3
0.189(4.800)
0.197(5.000)
.050
.028
0.049(1.250)
0.060(1.524)
0.053(1.350)
0.068(1.730)
0.200 (5.07 mm)
SEATING PLANE
0.001(0.030)
0.004(0.101)
0.140 (3.55mm)
0.060
Land Pattern
NOTE:
1) Control dimension is in inches. Dimension in bracket is millimeters.
2) Exposed Pad Option (N-Package) ; 2.31mm -2.79mm x 2.79mm - 3.81mm.
Recommend Solder Board Area: 2.80mm x 3.82mm = 10.7mm2 (16.6 mil2)
3) The length of the package does not include mold flash. Mold flash shall not exceed 0.006in. (0.15mm) per side.
With the mold flash included, over-all length of the package is 0.2087in. (5.3mm) max.
4) The width of the package does not include mold flash. Mold flash shall not exceed 0.10in. (0.25mm) per side.
With the mold flash included, over-all width of the package is 0.177in. (4.5mm) max.
MP1423 Rev. 1.1
1/6/2006
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