HFC0100—QUASI RESONANT CONTROLLER
ORDERING INFORMATION
Part Number*
Package
Top Marking
Free Air Temperature (TA)
SOIC8
HFC0100HS
HFC100
-40°C to +125°C
*For Tape & Reel, add suffix –Z (e.g. HFC0100HS–Z);
For RoHS compliant packaging, add suffix –LF (e.g. HFC0100HS–LF–Z)
PACKAGE REFERENCE
TOP VIEW
VSD
VCC
NC
1
2
3
4
8
7
6
5
FB
GND
CS
HV
Drive
ABSOLUTE MAXIMUM RATINGS (1)
HV Break Down Voltage.............. -0.7V to 700V
Vcc, DRV to GND ...........................-0.3V to 22V
FB, CS, VSD to GND........................-0.3V to 7V
Recommended Operation Conditions (3)
Operating Vcc range...........................8V to 20V
Maximum Junction Temp. (TJ) ............. +125°C
Thermal Resistance (4)
θJA
θJC
(2)
Continuous Power Dissipation…(TA = +25°C)
SOIC8 .....................................96 ...... 45...°C/W
………………………………………………....1.3W
Junction Temperature...............................150°C
Thermal Shut Down..................................150°C
Thermal Shut Down Hysteresis ..................50°C
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
Lead Temperature ....................................260°C
Storage Temperature .............. -60°C to +150°C
ESD Capability Human Body Model (All Pins
except HV) ............................................... 2.0kV
ESD Capability Machine Model ................. 200V
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.
HFC0100 Rev. 1.01
9/23/2011
www.MonolithicPower.com
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2011 MPS. All Rights Reserved.
3