MC33215
OUTLINE DIMENSIONS
FB SUFFIX
PLASTIC PACKAGE
CASE 848B–04
(TQFP–52)
ISSUE C
B
B
L
39
27
26
40
–A–, –B–, –D–
DETAIL A
DETAIL A
–B–
–A–
L
F
J
N
14
13
52
1
BASE METAL
D
–D–
M
S
S
B
0.02 (0.008)
C
A–B
D
M
S
S
0.20 (0.008)
H
A–B
D
D
SECTION B–B
0.05 (0.002) A–B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
V
M
S
S
0.20 (0.008)
C
A–B
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
DETAIL C
M
C
E
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
DATUM
–H–
PLANE
0.10 (0.004)
H
SEATING
PLANE
–C–
M
G
MILLIMETERS
INCHES
DIM
A
B
C
D
E
MIN
9.90
9.90
2.10
0.22
2.00
0.22
MAX
10.10
10.10
2.45
0.38
2.10
MIN
MAX
0.398
0.398
0.096
0.015
0.083
0.013
0.390
0.390
0.083
0.009
0.079
0.009
U
F
0.33
G
H
J
K
L
0.65 BSC
0.026 BSC
–––
0.13
0.65
0.25
0.23
0.95
–––
0.005
0.026
0.010
0.009
0.037
R
Q
7.80 REF
0.307 REF
M
N
Q
R
S
T
U
V
5
0.13
0
0.13
12.95
0.13
0
12.95
0.35
1.6 REF
10
0.17
7
0.30
13.45
–––
–––
13.45
0.45
5
0.005
0
0.005
0.510
0.005
0
0.510
0.014
0.063 REF
10
0.007
7
0.012
0.530
–––
–––
0.530
0.018
K
T
W
X
DETAIL C
W
X
19
MOTOROLA ANALOG IC DEVICE DATA
MOTOROLA [ MOTOROLA ]
