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V54C3256804VBT 参数 Datasheet PDF下载

V54C3256804VBT图片预览
型号: V54C3256804VBT
PDF下载: 下载PDF文件 查看货源
内容描述: 的256Mbit SDRAM 3.3伏, TSOP II / SOC BGA / WBGA封装16M ×16 , 32M ×8 , 64M ×4 [256Mbit SDRAM 3.3 VOLT, TSOP II / SOC BGA / WBGA PACKAGE 16M X 16, 32M X 8, 64M X 4]
分类和应用: 动态存储器
文件页数/大小: 52 页 / 838 K
品牌: MOSEL [ MOSEL VITELIC, CORP ]
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V54C3256(16/80/40)4V(T/S/B)  
Signal Pin Description  
Pin  
Type  
Signal Polarity  
Function  
CLK  
Input  
Pulse  
Positive  
Edge  
The system clock input. All of the SDRAM inputs are sampled on the rising edge of the  
clock.  
CKE  
CS  
Input  
Input  
Level Active High Activates the CLK signal when high and deactivates the CLK signal when low, thereby  
initiates either the Power Down mode or the Self Refresh mode.  
Pulse Active Low CS enables the command decoder when low and disables the command decoder when  
high. When the command decoder is disabled, new commands are ignored but previous  
operations continue.  
RAS,CAS  
WE  
Input  
Input  
Pulse Active Low When sampled at the positive rising edge of the clock, CAS, RAS, and WE define the  
command to be executed by the SDRAM.  
A0 - A11  
Level  
During a Bank Activate command cycle, A0-A12 defines the row address (RA0-RA12)  
when sampled at the rising clock edge.  
During a Read or Write command cycle, A0-An defines the column address (CA0-CAn)  
when sampled at the rising clock edge.CAn depends from the SDRAM organization:  
• 64M x 4 SDRAM CA0–CA9, CA11.  
• 32M x 8 SDRAM CA0–CA9.  
• 16M x 16 SDRAM CA0–CA8.  
In addition to the column address, A10(=AP) is used to invoke autoprecharge operation  
at the end of the burst read or write cycle. If A10 is high, autoprecharge is selected and  
BA0, BA1 defines the bank to be precharged. If A10 is low, autoprecharge is disabled.  
During a Precharge command cycle, A10(=AP) is used in conjunction with BA0 and BA1  
to control which bank(s) to precharge. If A10 is high, all four banks will BA0 and BA1 are  
used to define which bank to precharge.  
BA0,  
BA1  
Input  
Level  
Level  
Selects which bank is to be active.  
DQx  
Input  
Data Input/Output pins operate in the same manner as on conventional DRAMs.  
Output  
LDQM  
UDQM  
Input  
Pulse Active High The Data Input/Output mask places the DQ buffers in a high impedance state when sam-  
pled high. In Read mode, DQM has a latency of two clock cycles and controls the output  
buffers like an output enable. In Write mode, DQM has a latency of zero and operates as  
a word mask by allowing input data to be written if it is low but blocks the write operation  
if DQM is high.  
VCC, VSS Supply  
Power and ground for the input buffers and the core logic.  
VCCQ  
VSSQ  
Supply  
Isolated power supply and ground for the output buffers to provide improved noise  
immunity.  
V54C3256(16/80/40)4V(T/S/B) Rev. 1.6 September 2002  
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