V436664X24V
CILETIV LESOM
Byte Num-
ber
28
29
30
31
32
33
34
35
62-61
62
63
64
65-71
72
73-90
91-92
93
94
95-98
99-125
126
127
128+
Reserved
V436664X24V Rev. 1.0 January 2002
SPD-Table for modules: (Continued)
Hex Value
Function Described
Minimum Row Active to Row Active Delay t
RRD
Minimum RAS to CAS Delay t
RCD
Minimum RAS Pulse Width t
RAS
Module Bank Density (Per Bank)
SDRAM Input Setup Time
SDRAM Input Hold Time
SDRAM Data Input Setup Time
SDRAM Data Input Hold Time
Superset Information (May be used in Future)
SPD Revision
Checksum for Bytes 0 - 62
Manufacturer’s JEDEC ID Code
Manufacturer’s JEDEC ID Code (cont.)
Manufacturing Location
Module Part Number (ASCII)
PCB Identification Code
Assembly Manufacturing Date (Year)
Assembly Manufacturing Date (Week)
Assembly Serial Number
1 = US, 2 = Taiwan
V436664X24V
Current PCB Revision
Binary Coded year (BCD)
Binary Coded week (BCD)
byte 95 = LSB, byte 98 =
MSB
00
64
00
64
00
64
Mosel Vitelic
Revision 2 / 1.2
SPD Entry Value
14 ns/15 ns/16 ns
15 ns/20 ns
42 ns/45 ns
512Mbyte
1.5 ns/2.0 ns
0.8 ns/1.0 ns
1.5 ns/2.0 ns
0.8 ns/1.0 ns
-75PC
0E
0F
2A
80
15
08
15
08
00
02
38
40
00
-75
0F
14
2D
80
15
08
15
08
00
02
7D
40
00
-10PC
10
14
2D
80
20
10
20
10
00
12
EB
40
00
Intel Specification for Frequency
Supported Frequency
Unused Storage Location
00
00
00
6