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MSU2051C25 参数 Datasheet PDF下载

MSU2051C25图片预览
型号: MSU2051C25
PDF下载: 下载PDF文件 查看货源
内容描述: 低工作电压为16 MHz ROM MCU少 [low working voltage 16 MHz ROM less MCU]
分类和应用:
文件页数/大小: 21 页 / 121 K
品牌: MOSEL [ MOSEL VITELIC, CORP ]
 浏览型号MSU2051C25的Datasheet PDF文件第13页浏览型号MSU2051C25的Datasheet PDF文件第14页浏览型号MSU2051C25的Datasheet PDF文件第15页浏览型号MSU2051C25的Datasheet PDF文件第16页浏览型号MSU2051C25的Datasheet PDF文件第18页浏览型号MSU2051C25的Datasheet PDF文件第19页浏览型号MSU2051C25的Datasheet PDF文件第20页浏览型号MSU2051C25的Datasheet PDF文件第21页  
MO SEL VITELIC  
MSU2051/U2031  
44L Low profile Quad Flat Package  
C
L
L1  
S
θ2  
e
R1  
D2 D1 D  
Gage Plane  
0.25 mm  
b
A2  
θ3  
R2  
A1  
E2  
E1  
E
A
01  
seating plane  
C
θ
Dimension in Inch  
minimal/maximal  
Dimension in mm  
minimal/maximal  
- / 1.60  
Note:  
Symbol  
A
1.  
Dimension D1 and E1 do not include mold  
protrustion. Allowance protrusion is 0.25mm per side.  
D1 and E1 are maximal plastic body size dimensions  
including mold mismatch.  
- / 0.063  
A1  
A2  
b
0.05 / 0.15  
1.35 / 1.45  
0.30 / 0.45  
0.09 / 0.20  
12.00 BSC  
10.00 BSC  
8.00  
0.002 / 0.006  
0.053 / 0.057  
0.012 / 0.018  
0.004 / 0.008  
0.472 BSC  
2. Dimension b does not include dambar protrusion.  
Allowance dambar protrusion shall not cause the  
lead width to exceed the maximal b dimension by  
more than 0.08 mm.  
c
D
D1  
D2  
E
0.393 BSC  
0.315  
0.472 BSC  
0.393 BSC  
0.315  
12.00 BSC  
10.00 BSC  
8.00  
3.  
Dambar can not be located on the lower radius or the  
foot. Minimal space between protrusion and an  
adjacent lead is 0.07 mm for 0.4 mm and 0.5 mm  
pitch packages.  
E1  
E2  
e
0.031 BSC  
0.018 / 0.030  
0.039 REF  
0.003 / -  
0.80 BSC  
0.45 / 0.75  
1.00 REF  
0.08 / -  
L
L1  
R1  
R2  
S
0.003 / 0.008  
0.08 / 0.20  
0.20 / -  
0.008 / -  
0° / 7°  
0° / -  
θ
as left  
θ1  
θ2  
θ3  
C
as left  
as left  
11°/13°  
/13°  
11°  
0.004  
as left  
0.10  
Rev. 1.0 February 1998  
17  
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