CtomrGudlines
Visual Inspection Standard
All devices inspected to ANSI/J-STD-001B Class 2 standard
Moisture Sensitivity
Devices are moisture sensitive.
Shelf Life in Sealed Bag 12 months at <40OC and <90% relative humidity (RH).
After this bag has been opened, devices that will be subjected to infrared reflow, vapour phase reflow, or
equivalent processing (peak package body temp 220OC) must be :
A : Mounted within 72 Hours at factory conditions of <30OC/60% RH
OR
B : Stored at <20% RH
Iftheseconditionsarenotmetorindicatorcardis>20%whenreadat23OC +/-5% devicesrequirebaking
as specified below.
If baking is required, devices may be baked for :-
A : 24 hours at 125OC +/-5% for high temperature device containers
OR
B : 192 hours at 40OC +5OC/-0OC and <5% RH for low temperature device containers.
Packaging Standard
Devices packaged in dry nitrogen, JED-STD-020.
Packaged in trays as standard.
Tape and reel available for shipment quantities exceeding 200pcs upon request.
Soldering Recomendations
IR/Convection - Ramp Rate
Temp. exceeding 183OC 150 secs. max.
Peak Temperature
225OC
Time within 5OC of peak 20 secs max.
6OC/sec max.
Ramp down
6OC/sec max.
Vapour Phase - Ramp up rate
6OC/sec max.
215 - 219OC
Peak Temperature
Time within 5OC of peak 60 secs max.
Ramp down
6OC/sec max.
The above conditions must not be exceeded
Note : The above recommendations are based on standard industry practice. Failure to comply with
the above recommendations invalidates product warranty.
PAGE 12
Issue 5.2 April 2001
MOSAIC [ MOSAIC ]
