Military Screening Procedure
MultiChip Screening Flow
for high reliability product in accordance with Mil-883 method 5004 shown below
MB MULTICHIP MODULE SCREENING FLOW
SCREEN
Visual and Mechanical
Internal visual
Temperature cycle
Constant acceleration
2017 Condition B or manufacturers equivalent
1010 Condition B (10 Cycles,-55
°
C to +125
°
C)
2001 Condition E (Y
1
only) (10,000g)
100%
100%
100%
TEST METHOD
LEVEL
Burn-In
Pre-Burn-in electrical
Burn-in
Per applicable device specifications at T
A
=+25
°
C
Method 1015,Condition D,T
A
=+125
°
C,160hrs min
Per applicable Device Specification
a) @ T
A
=+25
°
C and power supply extremes
b) @ temperature and power supply extremes
a) @ T
A
=+25
°
C and power supply extremes
b) @ temperature and power supply extremes
a) @ T
A
=+25
°
C and power supply extremes
b) @ temperature and power supply extremes
Calculated at post burn-in at T
A
=+25
°
C
1014
Condition A
Condition C
Per applicable Device Specification
2009 Per vendor or customer specification
100%
100%
Sample
100%
100%
100%
100%
100%
100%
100%
10%
100%
100%
Final Electrical Tests
Static (dc)
Functional
Switching (ac)
Percent Defective allowable (PDA)
Hermeticity
Fine
Gross
Quality Conformance
External Visual
MOSAIC [ MOSAIC ]
