MSM832 - 70/85/10
ISSUE 4.4 : November 1998
32 pad Leadless Chip Carrier (LCC) - 'W' Package
11.70 (0.460)
11.30 (0.445)
2.03 (0.080)
max
1.27 (0.050) typ
0.64 (0.025) typ
No. 1 Index
14.22 (0.560)
13.84 (0.545)
10.42 (0.410)
9.92 (0.390)
7.87 (0.310)
7.37 (0.290)
1.27 (0.050)
typ
Minimum Order Product - Consult Factory for details
SCREENING
Military Screening Procedure
The Component Screening Flow
for high reliability parts in accordance with Mil-883 method 5004 is shown below:
MB COMPONENT SCREENING FLOW
SCREEN
Visual and Mechanical
Internal visual
Temperature cycle
Constant acceleration
Pre-Burn-in electrical
Burn-in
Final Electrical Tests
Static (dc)
Functional
Switching (ac)
Percent Defective allowable (PDA)
Hermeticity
Fine
Gross
External Visual
2010 Condition B or manufacturers equivalent
1010 Condition C (10 Cycles,-65
°
C to +150
°
C)
2001 Condition E (Y, only) (30,000g)
Per applicable device specifications at T
A
=+25
°
C
Method 1015,Condition D,T
A
=+125
°
C,160hrs min
Per applicable Device Specification
a) @ T
A
=+25
°
C and power supply extremes
b) @ temperature and power supply extremes
a) @ T
A
=+25
°
C and power supply extremes
b) @ temperature and power supply extremes
a) @ T
A
=+25
°
C and power supply extremes
b) @ temperature and power supply extremes
Calculated at post-burn-in at T
A
=+25
°
C
1014
Condition A
Condition C
2009 Per vendor or customer specification
100%
100%
100%
100%
100%
100%
100%
100%
100%
5%
100%
100%
100%
100%
100%
TEST METHOD
LEVEL
9
MOSAIC [ MOSAIC ]
