ISSUE 4.3 :November1998
MSM832-020/025/35
SCREENING
Military Screening Procedure
TheComponentScreeningFlowforhighreliabilitypartsinaccordancewithMil-883method5004isshownbelow:
MB COMPONENT SCREENING FLOW
SCREEN
TESTMETHOD
LEVEL
Visual and Mechanical
Internal visual
2010 Condition B or manufacturers equivalent
1010 Condition C (10 Cycles,-65°C to +150°C)
2001 Condition E (Y, only) (30,000g)
100%
100%
100%
100%
100%
Temperature cycle
Constant acceleration
Pre-Burn-in electrical
Burn-in
Per applicable device specifications at TA=+25°C
Method 1015,Condition D,TA=+125°C,160hrs min
Final Electrical Tests
Per applicable Device Specification
Static (dc)
a) @ TA=+25°C and power supply extremes
b) @ temperature and power supply extremes
100%
100%
Functional
a) @ TA=+25°C and power supply extremes
b) @ temperature and power supply extremes
100%
100%
Switching (ac)
a) @ TA=+25°C and power supply extremes
b) @ temperature and power supply extremes
100%
100%
Percent Defective allowable (PDA)
Hermeticity
Calculated at post-burn-in at TA=+25°C
1014
5%
Fine
Gross
Condition A
Condition C
100%
100%
External Visual
2009 Per vendor or customer specification
100%
10