MSM8128 - 70/85/10/12
Issue 4.5 : April 2001
Alternate Pin Definition
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
D0
D1
D2
GND
1
2
3
4
5
6
7
8 TOP VIEW
VX,SX
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
A15
NC
WE
A13
A8
A9
A11
OE
A10
CS
D7
D6
D5
D4
D3
Military Screening Procedure
Component Screening Flow
for high reliability product is in accordance with Mil-883 method 5004
MB COMPONENT SCREENING FLOW
SCREEN
Visual and Mechanical
Internal visual
Temperature cycle
Constant acceleration
Pre-Burn-in electrical
Burn-in
Final Electrical Tests
Static (dc)
Functional
Switching (ac)
2010 Condition B or manufacturers equivalent
1010 Condition C (10 Cycles,-65
o
C to +150
o
C)
2001 Condition E (Y, only) (30,000g)
Per applicable device specifications at T
A
=+25
o
C
Method 1015,Condition D,T
A
=+125
o
C,160hrs min
Per applicable Device Specification
a) @ T
A
=+25
o
C and power supply extremes
b) @ temperature and power supply extremes
a) @ T
A
=+25
o
C and power supply extremes
b) @ temperature and power supply extremes
a) @ T
A
=+25
o
C and power supply extremes
b) @ temperature and power supply extremes
Calculated at post-burn-in at T
A
=+25
o
C
1014
Condition A
Condition C
2009 Per vendor or customer specification
100%
100%
100%
100%
100%
100%
100%
100%
100%
5%
100%
100%
100%
100%
100%
TEST METHOD
LEVEL
Percent Defective allowable (PDA)
Hermeticity
Fine
Gross
External Visual
'