MSM8128-70/85/10/12
Issue 4.4 : February 2000
Alternate Pin Definition
NC
A16
A14
A12
A7
1
2
3
4
5
32
31
30
29
28
27
26
VCC
A15
NC
WE
A13
A8
A6
A5
6
7
A9
A4
A3
A2
A1
A0
D0
D1
D2
8
9
TOP VIEW 25
A11
OE
A10
CS
D7
D6
D5
D4
D3
VX,SX
24
23
22
21
20
19
18
17
10
11
12
13
14
15
16
GND
Military Screening Procedure
Component Screening Flow for high reliability product is in accordance with Mil-883 method 5004
MB COMPONENT SCREENING FLOW
SCREEN
TEST METHOD
LEVEL
Visual and Mechanical
Internal visual
2010 Condition B or manufacturers equivalent
1010 Condition C (10 Cycles,-65oC to +150oC)
2001 Condition E (Y, only) (30,000g)
100%
100%
100%
100%
100%
Temperature cycle
Constant acceleration
Pre-Burn-in electrical
Burn-in
Per applicable device specifications at TA=+25oC
Method 1015,Condition D,TA=+125oC,160hrs min
Final Electrical Tests
Per applicable Device Specification
Static (dc)
a) @ TA=+25oC and power supply extremes
b) @ temperature and power supply extremes
100%
100%
Functional
a) @ TA=+25oC and power supply extremes
b) @ temperature and power supply extremes
100%
100%
Switching (ac)
a) @ TA=+25oC and power supply extremes
b) @ temperature and power supply extremes
100%
100%
Percent Defective allowable (PDA)
Hermeticity
Calculated at post-burn-in at TA=+25oC
1014
5%
Fine
Gross
Condition A
Condition C
100%
100%
External Visual
2009 Per vendor or customer specification
100%
9
MOSAIC [ MOSAIC ]
